Appeal No. 2005-0883
Application No. 08/964,518
THE INVENTION
The invention relates to “semiconductor devices, and more
particularly to a ceramic or plastic stabilizer/spacer for
devices having high pin count lead frames” (specification, page
1). Representative claim 1 reads as follows:
1. A leadframe/stabilizer for use with semiconductor
devices, comprising:
(a) an electrically conductive leadframe having a central
semiconductor die-receiving region and a plurality of leadframe
leads extending outwardly from said central die-receiving region;
and
(b) a stabilizer extending partially along the length of and
on each side of said leadframe leads to improve leadframe
planarity, said stabilizer including:
(i) a die pad mount integral with and forming a part of
said stabilizer disposed beneath said central semiconductor die-
receiving region for retaining a semiconductor die thereon.
THE PRIOR ART
The reference relied on by the examiner to support the final
rejection is:
Hojyo 5,559,364 Sep. 24, 1996
THE REJECTION
Claims 1 through 14 stand rejected under 35 U.S.C. § 102(b)
as being anticipated by U.S. Patent No. 5,559,364 to Hojyo.
2
Page: Previous 1 2 3 4 5 6 7 8 Next
Last modified: November 3, 2007