Appeal No. 2005-0883
Application No. 08/964,518
rails and section bars. The assembly also includes a resin lead-
retaining section 14 molded to and between the inner portions of
the leads (see Figures 4 through 6), and a chip 22 mounted on the
die pad and electrically connected to the leads.
Independent claims 1 and 6 recite a leadframe/stabilizer
comprising, inter alia, a stabilizer which (1) extends partially
along the length of and on each side of the leadframe leads and
(2) includes a die pad mount integral with and forming a part of
the stabilizer. Similarly, independent claim 10 recites a method
for stabilizing the leads of a leadframe comprising, inter alia,
the steps of (1) providing a stabilizer having a die pad integral
therewith and (2) adhering the stabilizer along part of the
length and on each side of the leadframe leads. In rejecting
these claims as being anticipated by Hojyo (see pages 3 through 5
in the answer), the examiner reads the stabilizer limitations on
Hojyo’s lead retaining section 14 and the die pad or die pad
mount limitations on Hojyo’s die pad 11. The appellants counter
that anticipation does not lie because “in Hojyo . . . die pad 11
is separate from the rectangle 14, not integral as required by
[claims 1, 6 and 10]” (reply brief, page 2).
Hojyo discloses the die pad 11 and lead retaining section 14
as separate and distinct elements which are made of disparate
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