Ex Parte Hu et al - Page 1



            The opinion in support of the decision being entered today was not        
            written for publication and is not binding precedent of the Board.        



                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                    _____________                                     
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                    _____________                                     
            Ex parte CHAO-KUN HU, ROBERT ROSENBERG, JUDITH MARIE RUBINO,              
                CARLOS JUAN SAMBUCETTI, and ANTHONY KENDALL STAMPER                   
                                    _____________                                     
                                Appeal No. 2005-0998                                  
                             Application No. 10/054,605                               
                                   ______________                                     
                                    ON BRIEF                                          
                                   _______________                                    
          Before CAROFF, JEFFREY T. SMITH, and PAWLIKOWSKI, Administrative            
          Patent Judges.                                                              
          CAROFF, Administrative Patent Judge.                                        
                                 DECISION ON APPEAL                                   
               This is a decision on appeal from the examiner’s final                 
          rejection of claims 1-5, 7-10, 18-22, 24-27 and 35-38, all the              
          claims now pending in appellants’ involved application.                     
               The appealed claims are directed to a method for forming               
          conductors having high electromigration resistance by forming a             
          conductive film of 1-20 nanometers thickness over the upper                 
          surface of a conductor element.  We note that in the prior art              





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