The opinion in support of the decision being entered today was not written for publication and is not binding precedent of the Board. UNITED STATES PATENT AND TRADEMARK OFFICE ____________ BEFORE THE BOARD OF PATENT APPEALS AND INTERFERENCES ____________ Ex parte DAVID RUSSELL EVANS ____________ Appeal No. 2005-1220 Application No. 09/270,606 ____________ ON BRIEF ____________ Before KIMLIN, WALTZ and KRATZ, Administrative Patent Judges. KRATZ, Administrative Patent Judge. DECISION ON APPEAL This is a decision on appeal from the examiner's final rejection of claims 1-20, which are all of the claims pending in this application. BACKGROUND Appellant's invention relates to a chemical-mechanical polishing (CMP) process. An understanding of the invention can be derived from a reading of exemplary claims 1 and 13, which are reproduced below. 1. An method of fabricating an integrated circuit using CMP comprising: providing a substrate with an overlying silicon dioxide layer, and without any dummy structure; forming a CMP slurry containing cerium oxide;Page: 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 NextLast modified: November 3, 2007