Appeal No. 2005-1398 Page 2
Application No. 10/202,359
BACKGROUND
The appellants’ invention relates to a method for connecting a semiconductor
device to a substrate. Claim 1, which is representative of the invention, is reproduced in
the opinion section of this decision. A copy of the claims under appeal is set forth in the
appendix to the appellants’ brief.
The Rejection
The following rejection is before us for review.
Claims 1-3, 7 and 8 stand rejected under 35 U.S.C. § 102(b) as being anticipated
by Grabbe2.
Rather than reiterate the conflicting viewpoints advanced by the examiner and
the appellants regarding the above-noted rejection, we make reference to the answer
(mailed July 30, 2004) for the examiner's complete reasoning in support of the rejection
and to the brief (filed May 17, 2004) and reply brief (filed September 30, 2004) for the
appellants’ arguments thereagainst.
OPINION
In reaching our decision in this appeal, we have given careful consideration to
the appellants’ specification and claims, to the applied Grabbe patent, and to the
respective positions articulated by the appellants and the examiner. For the reasons
which follow, we shall sustain the rejection.
Appellants’ independent claim 1 reads as follows:
2 US Pat. No. 5,104,324, issued April 14, 1992, to Grabbe et al.
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