Appeal No. 2005-1398 Page 3
Application No. 10/202,359
1. A method for connecting at least one semiconductor
device to a substrate, comprising:
providing a carrier substrate with at least one
alignment device thereon, the at least one alignment device
including at least one receptacle configured to receive at
least an edge of the at least one semiconductor device; and
inserting at least the edge of the at least one
semiconductor device into the at least one receptacle with
the at least one semiconductor device oriented nonparallel to
the carrier substrate, a feature of the at least one
semiconductor device retaining a complementary feature of
the at least one alignment device.
Claim 1 reads on Grabbe’s method of insertion of semiconductor device 92 into
connector 80 on substrate 86, as illustrated in Figures 5-7, as follows. Grabbe
discloses providing a carrier substrate 86 with at least one alignment device (connector
80) thereon, the alignment device including at least one receptacle (channel 64)
configured to receive at least an edge of semiconductor device 92 and inserting at least
an edge of the semiconductor device 92 into the receptacle (channel 64) with the
semiconductor device 92 oriented nonparallel to the substrate 86 (note Figures 6 and
7). As illustrated in Figure 7, the contact pad 96 of the semiconductor device 92 retains
the spring arm 18 of the alignment device (connector 80) against surface 78 of wall 58
of the connector 80 by contact of the contact pad 96 against a contact surface 38 of the
spring arm 18.
The appellants’ argument (brief, page 7; reply brief, page 4) that Grabbe’s
semiconductor device 92 lacks any feature that retains a corresponding feature of the
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