Appeal 2005-2100
Application 09/826,038
Funk teaches use of the feed forward technique. As admitted by Appellant on
page 7 of the Brief, Funk teaches a feed forward control mechanism with regard to the
manufacture of semiconductor devices (obtaining a variable after a first process to
modify the operation of a second process). See, e.g., column 5 of Funk beginning at
line 22 through column 6, line 22. In this disclosure, Funk teaches the use of the feed
forward technique (wafers are tested for collecting data to be used in determining
processing steps of the wafer). Funk teaches the use of feed forward control to enable
feed forward control to areas of manufacturing (Funk, col. 3, ll. 27-30). As a specific
example, Funk teaches an etching material result that includes FICD and the resulting
FICD parameter is fed forward for further processing (Funk, col. 10, ll. 58-61).
Appellant argues that Funk does not specifically teach the specific set of
processing steps of dry etching and wet etching and in a specific order (i.e., wet
etching after dry etching). However, as explained by the Examiner on pages 3-4 of the
Answer, Funk teaches that material may be etched using different etch processes, such
as wet etch and plasma etch (dry etch). See column 11, lines 12 through 15 of Funk.
The Examiner points out that Funk teaches that the process control system according to
Funk performs a process including a plurality of process steps that are performed in a
sequence. See column 2, lines 38 through 40 of Funk. Funk also teachings that
multiple chambers are utilized in conducting a set of processing steps. See column 11,
lines 15-16 lines 33-53. Funk teaches that the material may be etched in multiple
etching chambers (Funk, col. 11, lines 13-15, and 21-53).
Our dissenting colleague believes that such teachings would not have suggested
to one of ordinary skill in the art to perform a dry etching step followed by a wet
etching step. We disagree. The fact that Funk does not attach an importance to the
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