Appeal No. 2005-2626
Application No. 09/954,149
BACKGROUND
Appellant's invention relates to a power semiconductor device. A copy of
independent claim 1 is reproduced below.
1. A power semiconductor device with an electrode structure for taking out
electrodes from a power semiconductor element mounted on one of a plurality of
first circuit patterns formed on an insulating substrate inside of a case up to an
external-connection terminal exposed outside of the case, wherein
the external-connection terminal is insert-molded into the case and
exposed outside of the case at one end of the terminal while the terminal
includes a junction portion having a junction face joined at its other end to a
second circuit pattern different from the first circuit pattern on which the power
semiconductor element is mounted and directly connected with the power
semiconductor element through a wire member bonded to the face opposite to
the junction face of the terminal junction portion.
The prior art references of record relied upon by the examiner in rejecting the
appealed claims are:
Mangiagli et al. (Mangiagli) 6,320,258 Nov. 20, 2001
(filed Mar. 23, 1994)
Appellant’s Admitted Prior Art (AAPA) Figures 7 and 8 and pp 1-3 of the specification.
Claims 1-6 stand rejected under 35 U.S.C. § 103 as being unpatentable over
AAPA in view of Mangiagli.
Rather than reiterate the conflicting viewpoints advanced by the examiner and
appellant regarding the above-noted rejections, we make reference to the Answer
2
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