Appeal No. 2006-0126
Application No. 10/140,619
positioned over the ultraviolet-hardening adhesive for
providing an ultraviolet ray to harden the adhesive
material and disposed slanted in alignment with the
inclined surface area; an optical sensor also disposed
slanted in alignment with the inclined surface area and
positioned under the ultraviolet-hardening adhesive for
measuring a power change of the ultraviolet ray that has
penetrated the adhesive material; an optical power-meter
for displaying the power change in the ultraviolet ray
based on the output from the optical sensor; and, a
controller for detecting when the adhesive material is
completely hardened based on the output from the optical
power-meter.
4. A method for assembling a PLC (Planar Lightwave
Circuit) module, the method comprising the steps of:
providing a device having a PLC (Planar Light Circuit)
chip and an optical-fiber block, the contacting surface
between the PLC chip and the optical-fiber block having
an inclined contact area at a predetermined angle;
providing an adhesive material between the contact area
of the PLC chip and the optical-fiber block; slanting an
ultraviolet ray into alignment with said inclined contact
area in applying the ray to the adhesive material at the
predetermined angle to harden the adhesive material; and,
monitoring a change in the ultraviolet-ray output that
penetrated the adhesive material in a substantially
vertical direction.
THE REFERENCES
Reference relied upon by the examiner
Kojima et al. 2002/0033546 A1 Mar. 21, 2002
(Kojima ‘546, U.S. patent application publication)
Reference relied upon by the appellants
Kojima et al. 2003/0026919 A1 Feb. 6, 2003
(Kojima ‘919, U.S. patent application publication)
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