Appeal No. 2006-0364
Application No. 10/068,400
positioning an IC chip adjacent to a substrate with a
thermosetting adhesive between said IC chip and said substrate to
adhere said IC chip to said substrate, said substrate comprising
an epoxy resin reinforced with fiberglass; and
irradiating said substrate with near infrared light toward
said IC chip such that some energy of said light is absorbed by
said substrate and some energy of said light passes through said
substrate to said adhesive to substantially cure said adhesive.
25. A method as set forth in claim 22 further comprising the
step of halting the irradiating step after said adhesive is
heated to a predetermined, curing temperature, and after the
halting step, cooling said assembly to substantially room
temperature and applying pressure on said IC chip toward said
substrate during substantially the entirety of said cooling step.
The examiner relies upon the following references as
evidence of obviousness:
Uchiyama et al. 5,847,796 Dec. 8, 1998
(Uchiyama)
Oxman et al. (Oxman) 6,395,124 B1 May 28, 2002
(filed Jul. 30, 1999)
Appellants' claimed invention is directed to a method of
forming a bonded assembly wherein an IC chip is bonded to a
substrate with a thermosetting adhesive. The adhesive is heated
with near infrared light to curing temperature, and then cooled
to room temperature under the application of pressure on the IC
chip.
Appealed claims 25, 32 and 39 stand rejected under 35 U.S.C.
§ 103(a) as being unpatentable over Oxman in view of Uchiyama.
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