Ex Parte Kobayashi et al - Page 4



         Appeal No. 2006-0364                                                      
         Application No. 10/068,400                                                

         obvious for one of ordinary skill in the art to apply pressure to         
         the chip during cooling in the process of Oxman.                          
              Although Uchiyama, as argued by appellants, discloses that           
         pressure is removed after the temperature reaches 150°C during            
         the cooling process, we concur with the examiner that it would            
         have been a matter of obviousness for one of ordinary skill in            
         the art to maintain the pressure throughout the entirety of the           
         cooling step.  It is well settled that when patentability is              
         based upon a change in a process parameter, such as temperature,          
         pressure and concentration, the applicant must demonstrate that           
         the change is critical, i.e., it leads to a new and unexpected            
         result.  In re Woodruff, 919 F.2d 1575, 1578, 16 USPQ2d 1934,             
         1936 (Fed. Cir. 1990); In re Aller, 220 F.2d 454, 456, 105 USPQ           
         233, 235 (CCPA 1955).  Since appellants have not proffered any            
         objective evidence which establishes that maintaining the                 
         pressure until room temperature is reached produces an unexpected         
         result, the inference of obviousness established by the prior art         
         remains unrebutted.  Also, we agree with the examiner that:               
              [O]ne skilled in the art would have readily appreciated              
              maintaining the pressure as long as necessary in order               
              to ensure proper adhesion and that such is a function                
              of a variety of factors, such as the material worked                 
              upon, the curing properties of the adhesive, the                     
              thermal coefficients of expansion of the materials,                  
              etc.                                                                 

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