Appeal No. 2006-0562
Application No. 09/952,588
BACKGROUND
The appellants’ invention relates to a solid state power amplifying device. A
copy of representative claims 39 and 55 under appeal are set forth below.
39. A solid state power amplifying device comprising:
a die;
a first input bond pad mounted on the die;
a first input lead; and
a first bond wire positioned on the first input lead to control the magnitude
of high frequency current delivered to the first input bond pad.
55. A solid state power amplifying device comprising:
a die;
a first input bond pad mounted on the die;
a second input bond pad mounted on the die;
a first input lead;
a first bond wire coupled between the first input bond pad and a first edge
of the first input lead; and
a second bond wire coupled between the second input bond pad and a
second edge of the first input lead, the first and second bond wires are
positioned on the first input lead to control the magnitude of high frequency
current delivered to the first and second input bond pads, wherein an equivalent
magnitude of current is supplied to the first and second input bond pads.
The prior art references of record relied upon by the examiner in rejecting the
appealed claims are:
2
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