Appeal No. 2006-1230 Παγε 9
Application No. 10/137,586
within encapsulant resin 1 (see page 2, first
paragraph of the translation). Since Saito teaches
marking on a surface of a resin 1, and resin 1 is
located on a surface of the semiconductor die, then
Saito teaches marking on a surface of a semiconductor
die, as claimed.
Accordingly, the rejection of claim 8 under 35 U.S.C. § 102(b) is
affirmed.
We turn next to independent claim 9. We will sustain the
rejection of claim 9 for the reasons set forth by the examiner
(answer, pages 4, 5 and 8) and for the reasons set forth, supra,
with respect to claim 1. the rejection of claim 9 under 35
U.S.C. § 102(b) is affirmed.
We turn next to claim 10. Appellant asserts (brief, page
12) that Saito does not teach marking on a surface of a die or a
surface from which a die is formed. From our review of the
record, we agree with the examiner, for the reasons set forth in
the answer (page 9) that “[s]ince Saito teaches marking on a
surface of a resin 1, and resin 1 is located on a surface of the
semiconductor die, then Saito teaches marking on a surface of a
semiconductor die, as claimed.” Accordingly, the rejection of
claim 10 under 35 U.S.C. § 102(b) is affirmed.
We turn next to claim 11. We affirm the rejection of claim
11 for the same reasons as we affirmed the rejection of claim 2.
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