The opinion in support of the decision being entered
today was not written for publication and is not binding
precedent of the Board.
UNITED STATES PATENT AND TRADEMARK OFFICE
_______________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
_______________
Ex parte HIDEKIYO TAKAOKA
And KIYOTAKA MAEGAWA
______________
Appeal No. 2006-1756
Application 10/087,742
_______________
ON BRIEF
_______________
Before PAK, WARREN and KRATZ, Administrative Patent Judges.
WARREN, Administrative Patent Judge.
Decision on Appeal
This is an appeal under 35 U.S.C. § 134 from the decision of the examiner finally
rejecting claims 1 through 6, all of the claims in the application.
Claims 1, 2 and 6 illustrate appellants’ invention of a lead-free solder, and are
representative of the claims on appeal:
1. A lead-free solder consisting essentially of:
at least one selected from the group consisting of 0.01 to 1% by weight of Co, 0.01 to
0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, and 0.01 to 2% by weight of Pd;
0.5 to 1% by weight of Cu; and
90.5% by weight or more of Sn.
2. A soldered article comprising an article containing a transition metal conductor and
being joined through a solder, said transition metal conductor being liable to spread in molten
Sn, wherein said solder is a lead free solder according to claim 1.
- 1 -
Page: 1 2 3 4 5 6 7 8 9 Next
Last modified: November 3, 2007