Ex Parte Takaoka et al - Page 5


               Appeal No. 2006-1756                                                                                                  
               Application 10/087,742                                                                                                

               therein falling within claim 1, to the Cu conductor of any manner of electronic equipment,                            
               notwithstanding whether that person would have recognized that Cu is liable to spread in molten                       
               Sn.                                                                                                                   
                       Appellants finally submit with respect to Rikiya that “there is no suggestion to pick only                    
               one member of the group” of elements specified in appealed claim 1 as required by claim 6                             
               (brief, pages 8-9).  We agree with the examiner’s position (answer, page 5), and particularly in                      
               view of the substantial evidence that Rikiya (e.g., [0011] and [0014]) would have taught that the                     
               lead-free solder disclosed therein containing Cu, Sn, and Bi and/or In, can further contain “one”                     
               of, among others, Pd and Fe, which is all that claim 6 requires.                                                      
                       We now consider Carey and appellants’ contentions that the tin alloys taught in cols.                         
               27 through 30 of the reference contain one or more of a number of “elements, one of which is                          
               even lead,” that “[n]one of the specific tin alloys” falls within the claims, and that “preferred                     
               compositions (col. 30, lines 6-29) do not contain copper” (brief, page 7).  On this basis,                            
               appellants submit that “[t]here are many millions of combinations that fall within” the teachings                     
               of the reference “before considering [sic] amount of each element,” and that the reference would                      
               have disclosed “tens of millions, if not hundreds of millions, of compositions outside of the                         
               scope of the claims,” arguing that “[t]here is clearly no motivation to manipulate the Carey                          
               disclosure to realize the claimed solder” or “guidance about which elements to select and which                       
               to ignore, or how to adjust concentrations” (id., pages 7-8; reply brief, pages 3-4).  Appellants                     
               thus submit that the disclosure of the reference “does not render a claim to a small number of                        
               compounds obvious,” relying on In re Baird, 16 F.3d 380, 29 USPQ2d 1550 (Fed. Cir. 1994),                             
               and In re Jones, 958 F.2d 347, 21 USPQ2d 1941 (Fed. Cir. 1992) (brief, pages 7-8; reply brief,                        
               pages 3-4).  The examiner responds that one of ordinary skill in this art would have been                             
               motivated to select the claimed elements in ranges of amounts from the disclosure of Carey in                         
               the reasonable expectation of arriving at a composition which achieves Carey’s objectives                             
               (answer, page 6).                                                                                                     
                       We find substantial evidence in the record supporting the examiner’s position.  We find                       
               that Carey would have disclosed to one of ordinary skill in this art general, typical and preferred                   
               formulations for Sn alloys which can be used as lead-free solders by listing elements in ranges of                    
               amounts which would provide alloys that have the characteristics taught by the reference (e.g.,                       

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