Appeal 2006-2343
Application 10/246,620
INTRODUCTION
The claims are directed to a roll of punched adhesive tape. The
Specification explains that the tape is provided for use in fabricating
semiconductor devices. The tape contains a base film and an adhesive layer
provided on one or each side of the base film. The tape is pierced with at
least one punched hole which is made by punching the adhesive tape at or in
the vicinity of regions of the tape containing contaminants or defects
(Specification 2:18-24). Hole punching serves as a method of removing
contaminants or defects from the tape or marking those regions so they can
be avoided during the application of the tape to the semiconductor device
(Specification 2:5-17). Claim 1 is illustrative of the subject matter on
appeal:
1. A roll of punched adhesive tape for semiconductor, made from
an adhesive tape containing at least one of contaminants and defects at at
least one region of the adhesive tape, consisting essentially of said adhesive
tape containing at least one of contaminants and defects and which consists
essentially of a base film and an adhesive layer provided on one or each side
of the base film, and is pierced with at least one punched hole, which is
made by punching the adhesive tape through the base film and the adhesive
layer, at or in the vicinity of said at least one region where the adhesive tape
contains said at least one of the contaminants and defects.
The Examiner relied upon the following prior art to reject the claims:
von Kraewel US 4,804,434 Feb. 14, 1989
Sakumoto US 5,277,972 A Jan. 11, 1994
Huss US 5,614,274 A Mar. 25, 1997
Keller US 5,691,023 A Nov. 25, 1997
Lee (as translated) KR 0122305 May 8, 19981
1 Because Appellants and the Examiner refer to this document as “UM305”
we will do the same.
2
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