The opinion in support of the decision being entered today was not written
for publication and is not binding precedent of the Board.
UNITED STATES PATENT AND TRADEMARK OFFICE
__________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
__________
Ex parte DONALD FERRIER
__________
Appeal No. 2006-2387
Application No. 10/304,514
__________
ON BRIEF
__________
Before ADAMS, GRIMES, and LINCK, Administrative Patent Judges.
GRIMES, Administrative Patent Judge.
DECISION ON APPEAL
This appeal involves claims to a composition and process for increasing
adhesion of a polymer to a metal surface. The examiner has rejected the claims as
obvious. We have jurisdiction under 35 U.S.C. § 134. We reverse.
Background
One method of forming a “multilayer printed circuit board is through additive or
surface laminer [sic] circuitry techniques. These techniques begin with a non-
conductive substrate, upon which the circuit elements are additively plated.”
Specification, page 2. “It has long been known that the strength of the adhesive bond
formed between the copper metal of the circuitry innerlayers and the . . . non-
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Last modified: November 3, 2007