Appeal No. 2006-2387 Page 2
Application No. 10/304,514
conductive coatings[ ] in contact therewith leaves something to be desired, with the
result that the cured multilayer composite . . . is susceptible to delamination in
subsequent processing and/or use.” Id.
The specification discloses that “the addition of unsaturated alkyls with cyclic
aromatic or non-aromatic substituents to adhesion promoting compositions used in
bonding preparation gives improved cosmetic appearance and acceptable adhesion of
polymeric materials on treated copper surfaces.” Page 15.
Discussion
1. Claim construction
Claims 1-36 are on appeal. Claim 9 is representative and reads as follows:
9. A composition useful in treating metal surfaces prior to bonding polymeric
materials to the metal surfaces, said composition comprising:
a) hydrogen peroxide;
b) an inorganic acid;
c) a corrosion inhibitor;
d) an unsaturated alkyl substituted with aromatic or non-aromatic
cyclic groups; and
e) optionally, but preferably, at least one material selected from the
group consisting of:
(i) sources of halide ions;
(ii) organic nitro compounds;
(iii) sources of adhesion enhancing species, which species are
selected from the group consisting of molybdates,
tungstates, tantalates, niobates, vanadates, isopoly or
heteropoly acids of molybdenum, tungsten, tantalum,
niobium, vanadium, and combinations of any of the
foregoing.
Thus, claim 9 is directed to a composition comprising hydrogen peroxide; an
inorganic acid (e.g., sulfuric acid; specification, page 9, line 15); a corrosion inhibitor
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