Appeal No. 2006-2649 Page 6
Application No. 10/336,259
This argument is not persuasive. La Scola relates to an electrically conductive
silicone composition, and teaches that the composition “may be employed . . . as
electrically conductive gaskets, as electrically conductive adhesives, as encapsulating
agents for electronic components and as cores for ignition cables.” Col. 11, lines 6-9.
Asai relates to silicone compositions for use in electrical equipment, and teaches that
the compositions are suitable “for use in electrical insulating materials, electrically
conductive materials, [etc.] in sealed or semi-sealed electrical equipment.” Page 9, third
paragraph (emphasis added). Since both La Scola and Asai relate to silicone
compositions for use in electrically conductive components, we do not agree that the
references are not within the same field of endeavor.
Appellants also argue that La Scola and Asai teach away from each other
because “La[ ]Scola discloses purposely adding organo silanes and unreactive,
organopolysiloxane diluents that evaporate at room temperature to the compositions . . .
[and] Asai discloses [that] organosiloxane oligomers and organo silanes can cause a
problem.” Appeal Brief, page 7.
This argument is also unpersuasive. Asai teaches that “silicone products
typically contain . . . volatile organosiloxane oligomers as by-products and residues of
the starting materials. In addition, . . . volatile organosiloxane oligomers or
organosilanes may be used together with the organopolysiloxane.” Page 3, first full
paragraph. Asai also discloses that the “organosilane or organosiloxane oligomers” are
responsible for the loss of conductivity of electrical contacts. See id.
However, Asai teaches that this problem can be avoided by including an alcohol
or glycol in the silicone composition. See page 4, fourth full paragraph, and page 7,
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