Appeal No. 2006-2833
Application No. 10/334,807
been provided through pins connecting the motherboard to the IC package. As
power demands of processors continue to rise, however, pin number-limited
connections cause increased heat dissipation within the device. The present
invention claims a capacitor, placed within a spaced portion between a
motherboard and IC package, in such a way so as to provide a conductive bridge
between the two. The additional conductive bridge is intended to decrease
power dissipation and subsequent heating within the device. The capacitor DC
shunts so arranged can therefore fulfill the dual function of providing decoupling
capacitors with the capability of supplying an additional path of power supply to
the die load.
Claim 10 is representative of the claimed invention and is reproduced as
follows:
10. A power shunt for use within a semiconductor device of a type having
a motherboard and an integrated circuit package electrically coupled to the
motherboard, said device further of a type having a spaced portion located
between the motherboard and the package, the power shunt comprising:
a capacitor adapted to be positioned within the spaced portion between
the motherboard and the package of the semiconductor device, said capacitor
having a conductive layer of a first type, a conductive layer of a second type, and
a dielectric layer that electrically isolates the first type conductive layer from the
second type conductive layer,
wherein said first type conductive layer and second type conductive layer
are adapted to form a conductive bridge between the motherboard and the
package.
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