Appeal 2006-1305
Application 10/236,270
INTRODUCTION
The claims are directed to a hot melt adhesive formulation having
high heat resistance and cold resistance. Claims 1 and 19 are illustrative:
1. A hot melt adhesive formulation having high heat resistance and cold
resistance and comprising from about 20 to about 45 wt % of an ethylene
copolymer having a high polar content and melt flow index of less than
about 400 grams/10 minutes, from about l to about 30 wt % of an ethylene
copolymer having a low polar content and melt flow index greater than
400 grams/10 minutes, a terpene phenol tackifier, and a wax.
19. A hot melt adhesive formulation comprising an ethylene copolymer
having a high polar content, an ethylene copolymer having a low polar
content, a terpene phenol tackifier, and a wax, wherein said ethylene
copolymer having a high polar content has a low melt flow index, and said
ethylene copolymer having a low polar content has a high melt flow index.
The Examiner relies on the following prior art references as evidence
of obviousness:
Daughenbaugh US 4,701,517 Oct. 20, 1987
Watanabe (as translated) JP 100130436 May 19, 1998
The rejections as presented by the Examiner are as follows:
1. Claims 1, 3-9, and 18-20 are rejected under 35 U.S.C § 103(a) under
35 U.S.C § 103(a) as unpatentable over Watanabe in view of
Daughenbaugh.
2. Claims 1 and 3-20 are rejected under 35 U.S.C § 103(a) as
unpatentable over the admitted prior art (Specification 1-2) in view of
Watanabe and Daughenbaugh.
We refer to the Brief and to the Answer for a complete discussion of
the opposing viewpoints expressed by the Appellants and by the Examiner
concerning the above-noted rejections.
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