Ex Parte Blees - Page 10

                 Appeal 2006-2571                                                                                    
                 Application 09/759,179                                                                              

                 uniformly spaced triangular projections 77 with ridges forming stamping                             
                 surface 81.                                                                                         
                        We find Whitesides FIG. 10 is an atomic force microscope image of                            
                 projections 77 with stamping surface 81 of article 74 in FIG. 9f, showing                           
                 triangular projections and separating indentations of uniform width and                             
                 depth (Whitesides col. 10, ll. 39-49).  Whitesides discloses that stamping                          
                 surface 81 can “include features having a lateral dimension of approximately                        
                 0.100 micron or less” as well as “small, isolated projections” that                                 
                 “approximate a point,” all of which can be in “an ordered array” (id. col. 14,                      
                 ll. 28-66).                                                                                         
                        Contrary to the Examiner’s finding, article 74 of FIGs. 9f and 10 is                         
                 not stamp 20 of FIGs. 1a-d and 3a-c.                                                                
                        We find Biebuyck would have disclosed in FIG. 2D an elastomeric                              
                 stamp for use in a lithographic process which has deformable or elastic layer                       
                 24 for conformal contact and a second patterned layer 22 with rectangular                           
                 stamping surfaces and indentations with submicron features of non-uniform                           
                 width and depth (Biebuyck cols. 1 and 2, and col. 3, l. 28, to col. 4, l. 12).                      
                        We find Hawkins would have described in FIG. 6 the last step of a                            
                 fabrication process of a three dimensional structure from silicon substrate 12                      
                 in which the frontside surface 12A of the silicon substrate with mechanically                       
                 protective layer 16 and patterned masking layer 14 is anisotropically etched                        
                 to produce recesses 32 and remove layer 16, wherein vias 29 in layer 14 are                         
                 of different sizes to produce recesses of varying depths (Hawkins col. 5, ll.                       
                 1-23).                                                                                              



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