Appeal 2007-0734
Application 09/908,455
superimposed on a precursor liquid? We answer this question in the
affirmative.
The Examiner correctly finds that Donges describes a method for
forming a pattern on a substrate that comprises disposing a pattern of liquid
underfill (flux) on a substrate using a template (the under surface of chip 40)
(Answer 3-4). The Examiner correctly finds that the liquid in the pattern is
spread to cover the entire region and form a continuous layer while
maintaining the template apart from the substrate (Answer 4). The
Examiner correctly finds that the ambient air is displaced when the
continuous layer is formed using the template (Answer 4).
Appellants contend that Donges is unrelated to the present invention
and that Donges fails to teach or suggest a template of any kind (Br. 8).
Appellants’ arguments are not persuasive. The Specification discloses
the techniques of the present invention may be used for a number of devices
including semiconductor devices (page 6). Appellants have not disputed that
Donges, like Appellants’ Specification, describes a semiconductor device.
The Specification discloses that when a template is positioned proximate to
the substrate the patterning liquid is dispersed to fill the gaps between the
template and the substrate (p. 5). Appellants have not argued that the chip
component of Donges (i.e. template) does not function to disperse the under-
filled liquid to fill the gaps between a substrate and the chip component.
The rejection of claims 150-156, 159-162, 165-171, 174, 175, 178, and 179
under 35 U.S.C. § 102(e) as anticipated by Donges is affirmed.
Claims 157, 158, 163, 164, 172, 173, 180, and 181 stand rejected
under 35 U.S.C. § 103(a) as obvious over Donges. We affirm.
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