Appeal 2007-0750
Application 10/427,656
a heat-dissipating substrate selected for at least one of the
following properties: size, shape, mass, coat, thermal conductivity,
environmental resistance; and
at least two heat-dissipating studs, each one of the at least two
heat-dissipating studs having a heat-dissipating layer and at least
one intermediate layer, one of the at least one intermediate layer of
each one of the at least two heat-dissipating studs in direct
attachment to the heat-dissipating substrate, respectively, the heat
dissipating layer of each one of the at least two heat-dissipating
studs in direct attachment to an electronic component, respectively;
wherein the heat-dissipating layer of at least two heat-dissipating
studs comprises a coefficient of thermal expansion similar to the
coefficient of thermal expansion of the electronic component
mounted thereon, respectively; and wherein each layer of the at
least one intermediate layer has a coefficient of thermal expansion
between the coefficient of thermal expansion of the heat
dissipating layer and the coefficient of thermal expansion of the
heat-dissipating substrate.
The Examiner relies upon the following references as evidence of
obviousness:
Joshi US 4,069,498 Jan. 17, 1978
Sherif US 5,623,394 Apr. 22, 1997
Di Giacomo US 6,214,647 B1 Apr. 10, 2001
Caletka US 6,333,551 B1 Dec. 25, 2001
Pinneo US 2002/0141155 A1 Oct. 3, 2002
Combs US 6,734,552 B2 May 11, 2004
Appellants’ claimed invention is directed to a heat sink assembly for
dissipating heat from at least two electronic components. The assembly
comprises a heat-dissipating substrate and at least two heat-dissipating studs.
The studs comprise a heat-dissipating layer directly attached to an electronic
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