Appeal 2007-0885
Application 10/053,497
thermoplastic hot melt adhesive composition, said composition comprising
an ethylene n-butyl acrylate copolymer and a modified terpene tackifier.
21. An improved process for bonding difficult-to-bond substrates
comprising bonding a first substrate to a second substrate with a hot melt
adhesive composition, said composition consisting essentially of 30 to 45 %
by weight ethylene n-butyl acrylate copolymer, 30 to 55 % by weight
tackifier, and 20 to 40 % by weight wax, wherein the tackifier comprises at
least one modified terpene tackifier.
The Examiner relies on the following prior art references to show
unpatentability:
Howells US 4,566,981 Jan. 28, 1986
Dupont US 5,325,781 Jul. 5, 1994
Milks US 5,401,791 Mar. 28, 1995
Gruber US 5,475,080 Dec. 12, 1995
Yang US 6,207,248 B1 Mar. 27, 2001
The Examiner made the following rejections:
1. Claims 1, 3, 21, and 30-32 under 35 U.S.C. § 103(a) as
unpatentable over Yang.
2. Claims 2 and 22 under 35 U.S.C. § 103(a) as unpatentable over
Yang in view of Milks.
3. Claims 4, 5, 23, and 24 under 35 U.S.C. § 103(a) as unpatentable
over Yang in view of Dupont.
4. Claims 6-8 and 25-27 under 35 U.S.C. § 103(a) as unpatentable
over Yang in view of Howells.
5. Claims 28 and 29 under 35 U.S.C. § 103(a) as unpatentable over
Yang in view of Gruber.
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