Appeal 2007-2179
Application 10/247,825
through electromagnetic force, and a high-frequency power source 9 for
supplying a high-frequency current to the induction coil (claim 8, Fig. 1).
Representative claims 8, 9, 10, and 12 read as follows:
8. A manufacturing apparatus of a semiconductor integrated circuit,
which passes a current through a target plating surface of a semiconductor
substrate, provided on a plating liquid, so as to provide a bump electrode on
the semiconductor substrate by electrolytic plating method, the
manufacturing apparatus comprising:
a positive electrode which is provided in a tank section for storing the
plating liquid,
a negative electrode which is connected to the target plating surface of
the semiconductor substrate;
an induction coil for causing the semiconductor substrate to vibrate
through electromagnetic force; and
a high-frequency power source for supplying a high-frequency current
to the induction coil.
9. The manufacturing apparatus of the semiconductor integrated
circuit according to claim 8, wherein the semiconductor substrate vibrates at
an audio frequency.
10. The manufacturing apparatus of the semiconductor integrated
circuit according to claim 8, wherein the induction coil is provided outside
the tank section.
12. The manufacturing apparatus of the semiconductor integrated
circuit according to claim 8, wherein the high-frequency power source can
vary an amplitude and a frequency of an alternating current to be supplied.
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Last modified: September 9, 2013