Appeal 2007-2554
Application 10/667,515
heat a cutting path formed on the non-metallic substrate and to form a scribe
line having a crack to a desired depth; and
a second laser beam generating means that generates a second laser
beam for propagating the crack along a scanning path of the first laser beam
in a depth direction of the substrate,
wherein the apparatus cuts the non-metallic substrate without a
cooling device.
In addition to the admitted prior art found in Appellants' Specification,
the Examiner relies upon the following references:
Chui US 3,930,825 Jan. 6, 1976
Kitajima US 6,320,158 B1 Nov. 20, 2001
Boyle US 6,841,482 B2 Jan. 11, 2005
Appellants' admission on page 5, lines 1-18 of the instant Specification.
Appellants' claimed invention is directed to an apparatus for cutting a
non-metallic substrate comprising means for generating a first and second
laser beam. The first laser beam is used to break the molecular bonds of the
substrate to heat a cutting path and form a scribe line therein, while the
second laser beam is used for propagating the crack along a scanning path
of the first laser beam. The apparatus cuts the substrate without a cooling
device.
Appealed claim 8 stands rejected under 35 U.S.C. § 102(b) as being
anticipated by Chui. The appealed claims also stand rejected under
35 U.S.C. § 103(a) as follows:
(a) claims 9-13 over Chui,
(b) claims 8, 9, 11, and 13 over the admitted prior art,
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