Ex Parte Harwell et al - Page 3

                Appeal 2007-2967                                                                              
                Application 10/274,827                                                                        
                      Claims 16-21 stand rejected under 35 U.S.C. § 103(a) as obvious over                    
                Flieger in view of Bozich and Kik.                                                            

                                               DISCUSSION                                                     
                Background                                                                                    
                             Hot melt adhesives, which are generally applied while in                         
                      the molten or liquid state are, solid at room temperature.                              
                      Typically, these adhesives are provided in the form of blocks                           
                      and because of the nature of these materials, particularly the                          
                      pressure sensitive hot melts, there are problems associated with                        
                      handling and packaging them.  The solid adhesive blocks not                             
                      only stick or adhere to hands or mechanical handling devices                            
                      but also to each other.  They also pick up dirt and other                               
                      contaminants.  Additionally, certain applications which require                         
                      high tack formulations result in blocks that will deform or cold                        
                      flow unless supported during shipment.                                                  
                      The need and advantages for providing tackless or non-                                  
                      blocking hot melt adhesives are apparent and various ways of                            
                      accomplishing this have been developed. While most of these                             
                      prior art methods have provided some degree of improvement                              
                      in the packaging and handling of hot melt adhesives, they have                          
                      suffered by virtue of either the need to unwrap or otherwise                            
                      unpackage the hot melt or, in the cases of coated hot melts                             
                      which are added directly to the melting pots, by virtue of the                          
                      contamination resulting from the build-up over time of large                            
                      quantities of the packaging materials in the                                            
                      melt pot and application equipment.                                                     

                (Spec. 1.)                                                                                    
                      The claimed invention addresses these problems by encasing the hot-                     
                melt adhesive “within a multi-layer film . . . [that] is meltable together with               
                the film and blendable into the molten adhesive” (Spec. 4).  “Multi-layer                     
                films may be made by the coextrusion of multiple polymer film resins into a                   

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