Appeal 2007-3874
Application 10/288,027
provision. See, e.g., In re Alton, 76 F.3d 1168, 1175-76, 37 USPQ2d 1578,
1583 (Fed. Cir. 1996).
In the absence of a prima facie case, we reverse the rejection of claims
7 and 8 under 35 U.S.C. § 112, first paragraph, written description
requirement.
Turning now to the ground of rejection under § 103(a), we find
Mahulikar would have disclosed to one of ordinary skill in this art the
embodiment illustrated in Fig. 5 thereof showing package 78 comprises
plastic housing 62 that, in addition to microelectronic device 22 on bonding
pad 66 and leadframe 18, has molded into its bottom surface heat spreader
76 that consists of metal layers 80,82,84, wherein leadframe 18 can be a
composite which is thermally conductive. Mahulikar col. 8, ll. 58-67.
Mahulikar discloses heat spreader 76 can be completely encapsulated within
plastic housing 62. Id. col. 9, ll. 1-7.
We find Unger would have disclosed to one of ordinary skill in this
art the embodiment illustrated in Fig. 5 thereof showing heat transfer plate
element 6 is mounted on heat sink 4, which has conductive fin structures
integrally connected to and emanating from a surface, wherein both element
6 and heat sink element 4 can be “a single, one-unit piece” manufactured
using the disclosed thermally conductive resin/fiber compound carbon-
carbon matrix composite material. Unger, e.g., col. 2, ll. 9-44; col. 3,
ll. 19-26 and 49-64; and col. 4, ll. 20-24. Unger discloses that after forming
the combination of elements 4 and 6, IC device 8 is positioned on top of
element 6. Id. col. 3, ll. 21-26.
A discussion of Ruechardt and Ross is not necessary to our decision.
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