Appeal No. 95-0543
Application 08/008,734
Claims 2, 6, 7 and 11 have been cancelled. Claims 4, 5 and 12-15
have been allowed by the examiner.
The claimed invention pertains to a structure for
eliminating heat from a semiconductor chip in a semiconductor
module.
Representative claim 1 is reproduced as follows:
1. A semiconductor module, comprising:
a semiconductor chip;
means affixed to said semiconductor chip for
eliminating heat from said semiconductor chip;
an electrically insulating and thermally conducting
layer of crystalline carbon between said semicon-
ductor chip and said means for eliminating heat;
at least one intermediate layer between said semicon-
ductor chip and said means for eliminating heat;
and
connecting layers of silver between said semiconductor
chip and said means for eliminating heat, wherein
only one of said connecting layers is between said
means for eliminating heat and said electrically
insulating and thermally conducting layer.
The examiner relies on the following reference:
Potter 3,872,496 Mar. 18, 1975
Claims 1 and 8 stand rejected under 35 U.S.C. § 102(b) as
being anticipated by the disclosure of Potter. Claim 3 stands
rejected alternatively under 35 U.S.C. § 102(b) or § 103 as being
anticipated by or unpatentable over Potter. Claims 9, 10, 16 and
2
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Next
Last modified: November 3, 2007