Ex parte ECKHARD WOLFGANG et al. - Page 2




          Appeal No. 95-0543                                                          
          Application 08/008,734                                                      


          Claims 2, 6, 7 and 11 have been cancelled.  Claims 4, 5 and 12-15           
          have been allowed by the examiner.                                          
          The claimed invention pertains to a structure for                           
          eliminating heat from a semiconductor chip in a semiconductor               
          module.                                                                     
          Representative claim 1 is reproduced as follows:                            
                    1.  A semiconductor module, comprising:                           
                    a semiconductor chip;                                             
                    means affixed to said semiconductor chip for                      
                         eliminating heat from said semiconductor chip;               
                    an electrically insulating and thermally conducting               
                         layer of crystalline carbon between said semicon-            
                         ductor chip and said means for eliminating heat;             
                    at least one intermediate layer between said semicon-             
                         ductor chip and said means for eliminating heat;             
                         and                                                          
                    connecting layers of silver between said semiconductor            
                         chip and said means for eliminating heat, wherein            
                         only one of said connecting layers is between said           
                         means for eliminating heat and said electrically             
                         insulating and thermally conducting layer.                   
          The examiner relies on the following reference:                             
          Potter                        3,872,496          Mar. 18, 1975              
                                                                                     
          Claims 1 and 8 stand rejected under 35 U.S.C.  102(b) as                   
          being anticipated by the disclosure of Potter.  Claim 3 stands              
          rejected alternatively under 35 U.S.C.  102(b) or  103 as being           
          anticipated by or unpatentable over Potter.  Claims 9, 10, 16 and           
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