Appeal No. 95-0543
Application 08/008,734
conducting layer” [brief, page 6]. The examiner has responded
that appellants are not giving claim 1 the appropriate scope
based on the recitations of claim 1.
It would be appropriate to first review the teachings of
Potter as applied by the examiner. Potter teaches a crystalline
carbon (4) connected between a chip (diode 11) and a means for
eliminating heat from the chip (copper base 1). There are four
metal layers between the carbon and the chip and between the
carbon and the base which serve to bond the three components
together. Each of the bonds is made up of a chromium-gold-gold-
chromium arrangement. Potter discloses that the gold-gold bond
could also be a silver-silver bond or a bond of silver-gold
[column 3, lines 43-45]. The examiner has taken the position
that the bond between the crystalline carbon and the copper base
could be a chromium-gold-silver-chromium bond within the
teachings of Potter. Likewise, the bond between the crystalline
carbon and the chip could have one or two silver layers.
When the Potter structure is viewed in this manner, there
is one silver layer between the copper base and the carbon (layer
16 or 2) and one or more silver layers between the carbon and the
5
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