Appeal No. 95-0785
Application 07/748,708
According to appellants, the invention is directed to a
thermoformable add-on EMI shielding sheet comprising a carrier
material with a partially embedded metal fiber mat therein
(brief, page 4). The carrier material must have a softening
temperature lower than the highest temperature reached during the
thermoforming process, while the metal fibers must have a melting
point lower than this highest thermoforming temperature (Id.).
Claims 1, 16 and 18 are illustrative of the subject matter
on appeal and are reproduced below:
1. A thermoformable add-on EMI shielding sheet
comprising a carrier material selected from the group consisting
of polymeric fibrous webs and sheet materials having the
capability of becoming porous during a thermoforming process,
said carrier material having a metal mat at least partially
embedded therein, said mat comprising a plurality of fine,
randomly-oriented metal fibers, said carrier material having a
softening temperature and said metal mat having a melting
temperature lower than the highest temperature reached during
said thermoforming process.
16. A thermoformed article comprising a substrate
polymer having an EMI shielding layer on a portion thereof, said
portion being less than the entire article, said shielding layer
having been precut from an add-on EMI shielding sheet, placed
atop said substrate polymer, and thermoformed therewith.
18. A thermoformed article made by a method comprising
the steps of:
a) providing a polymeric substrate having an area
where EMI shielding is desired;
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