Appeal No. 95-1009
Application 07/858,632
Simultaneous sputter and deposition occurs which results in
uneven net deposition (see column 2, lines 51-55, and Figure
2). To remedy this uneven net deposition (i.e., level it), an
additional deposition occurs with subsequent planarization
(i.e., smoothing, see column 2, lines 58-64, column 3, lines
50-62, column 5, lines 3-12, and column 5, line 54-column 6,
line 14). The uneven initial deposition results in a net
thickness of deposition that is lowest at the corners (column
5, lines 6-9, and Figure 2). Therefore Olmer specifically
describes leveling the height of portions of the filling
material, including leveling achieved by an additional
deposition of the filling material, and effecting a deposition
process such that the difference in thickness of the filler
material between a central portion and a peripheral portion
(i.e., the corner) is canceled out (see column 5, lines 9-12).
Olmer discloses a final step of “planarization” which may
be accomplished “in a known manner” to yield the smooth
surface of Figure 4 (see column 5, lines 62-64). Grinding and
etching are taught by Olmer as methods of planarizing the
surface (column 5, line 66-column 6, line 5). The polishing
step of the method of the appealed claims is not expressly
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