Appeal No. 95-1009
Application 07/858,632
APPENDIX
1. A method of fabricating an electronic device, of
the type wherein grooves formed a substrate are filled up with
a filling material deposited by a deposition process in which
etching and deposition are achieved concurrently, wherein the
improvement comprises:
leveling the height of portions of the filling
material deposited on these portions of the substrate other
than those corresponding to the grooves; and
thereafter, polishing away said portions of the
filling material to smooth an entire surface of the substrate.
17
Page: Previous 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 Next
Last modified: November 3, 2007