Appeal No. 95-1969
Application 08/024,913
The claimed invention is directed to an apparatus for
mounting at least two semiconductor integrated circuit chips
on a lead frame. The invention is described in detail on pages
2 through 5 of the appellants’ brief.
Claim 22, reproduced below, is further indicative of the
appealed subject matter.
22. An apparatus for automatically mounting first and
second semiconductor chips, each having a different outside
dimension, on an island of a lead frame, said apparatus
comprising:
first supply means for accommodating a plurality of lead
frames each having an island;
conveying means for conveying said lead frames from said
first supply means in a direction of conveyance, intermittently,
and for a distance so that the island of each of said lead frames
is stopped at a solder station and at a bonding station, said
solder station and said bonding station being spaced by said
distance in the direction of conveyance;
said conveying means including a tunnel cavity for
maintaining a nonoxidizing atmosphere at and between said solder
and bonding stations, said tunnel cavity including a guide member
for guiding said lead frames, a cover plate, and a heater block;
second supply means for supplying first and second wire
solders to each island at said solder station;
transfer means for transferring the first and second
semiconductor chips to each island in that order while said each
island is stopped at said bonding station, said transfer means
including first and second vacuum chucks corresponding to said
outside dimension of each of said first and second semiconductor
chips to be mounted; and
third supply means for consecutively supplying said first
and second semiconductor chips to said transfer means.
2
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Last modified: November 3, 2007