Appeal No. 95-1969
Application 08/024,913
note that Doubek teaches bonding the IC chips to the lead
frame with thermocompression bonding.
We further acknowledge that Kuehn discloses bonding dies to
a lead frame or the like using epoxy or solder. Küehn emphasizes
that the bonding is to take place in a work holder that is
completely sealed from the outside environment. Küehn teaches
that moisture in the outside environment has a deleterious
effect on the connections being formed. Finally, Baxter
discloses attaching components to a circuit board or a lead
frame using a retractable paste solder dispenser.
When we analyze the teachings of the applied references, we
first note that no reference teaches the claimed wire solder
important to appellants’ apparatus. While we agree with the
examiner that wire solder is old in this art, we disagree that
the paste solder dispenser of Baxter can be considered the same
as appellants’ claimed wire solder dispenser. Additionally, it
is unclear to us how the teachings of Küehn and Doubek could be
combined short of placing the entire Doubek apparatus in an
environmentally sealed room. Certainly, the combined teachings
would not have suggested a work holder shown by Küehn with access
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