Appeal No. 96-0155
Application No. 07/829,660
This is a decision on an appeal from the final rejection
of claims 1 through 25 which are all of the claims in the
application.
The subject matter on appeal relates to a method useful
in the backside processing of semiconductor wafers which
comprises bonding a processed first surface of the
semiconductor wafer to a support means such as a handle wafer
prior to processing a second surface of the wafer. This
appealed subject matter is adequately illustrated by
independent claims 8 and 18 which read as follows:
8. A method useful in the backside processing of
semiconductor wafers comprising the steps of:
providing a semiconductor wafer having a first surface
being substantially processed and a second surface;
bonding said first surface of said semiconductor wafer to
a handle wafer;
thinning said semiconductor wafer from said second
surface;
dicing said semiconductor wafer while bonded to said
handle wafer to form individual dice; and
removing said individual dice from said handle wafer.
18. A method useful in the backside processing of
semiconductor wafers comprising the steps of:
2
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