Appeal No. 96-0155
Application No. 07/829,660
providing a semiconductor wafer having a first surface
being substantially processed and a second surface;
bonding said first surface of said semiconductor wafer to
support means;
thinning said semiconductor wafer from said second
surface;
implanting impurities into said semiconductor wafer
through said second surface; and
removing said semiconductor wafer from said support
means.
The prior art relied upon by the examiner as evidence of
obviousness is set forth below:
Corrie 4,946,716 Aug. 7, 1990
Admitted Prior Art Pages 1-2 of the specification
All of the claims on appeal stand rejected under the
first paragraph of 35 U.S.C. § 112 "as failing to provide an
adequate written description of the invention" (answer, page
3, also page 4).
Claims 8 through 14 and 18 through 25 stand rejected
under 35 U.S.C. § 103 as being unpatentable over the admitted
prior art in view of Corrie.
Although the appellants assert that at least certain of
the appealed claims should not stand or fall together (see
pages 4 and 5 of the brief), no specific arguments have been
3
Page: Previous 1 2 3 4 5 6 7 8 Next
Last modified: November 3, 2007