Appeal No. 96-0155
Application No. 07/829,660
8). In response, the examiner explicitly points out, inter
alia, that "col. 2, lines 51-60 of Corrie teaches and suggests
as much" (answer, page 7).
The above noted portion of the Corrie reference refers to
a prior art patent in which "it is proposed that a CCD
imager... should be supported during thinning by means of a
plate of molybdenum, aluminum or glass that is bonded to the
die using epoxy adhesive or a bonding alloy" (col. 2, lines
51-56). Thus, as indicated by the examiner, the aforequoted
disclosure teaches bonding (i.e., via epoxy adhesive or a
bonding alloy) a wafer (i.e., a CCD imager) to a handle
wafer/support means (i.e., a plate of molybdenum, aluminum or
glass). Moreover, it is significant that the appellants have
not filed a reply brief or any other response challenging the
examiner's position on this matter.
In essence, the examiner has specifically identified the
portion of the Corrie reference which he considers to disclose
the here claimed features argued by the appellants to be not
taught or suggested by the prior art, and the examiner's
position on this matter has not been contested by the
appellants on the record before us. Under these
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