Appeal No. 96-0410
Application 08/161,015
final rejection of claims 1 to 8 and 10 to 17, which constitute
all the claims remaining in the application.
Claim 1 is reproduced below:
1. A method of testing an integrated circuit die,
comprising the steps of:
disposing flat solder pads on the integrated circuit die;
probing said flat solder pads to perform an electrical test
on the integrated circuit die before a reflow solder process; and
reflowing said flat solder pads following said probing step
to transform said solder pads into rounded solder bumps.
The following references are relied on by the examiner:
Mones et al. (Mones) 4,273,859 June 16, 1981
Temple et al. (Temple) 4,814,283 Mar. 21, 1989
LeParquier et al. (LeParquier) 5,002,895 Mar. 26, 1991
Koopman et al. (Koopman) 5,289,631 Mar. 01, 1994
(Filed Mar. 4, 1992)
All claims on appeal stand rejected under 35 U.S.C. § 103.
As evidence of obviousness, the examiner relies upon LeParquier
in view of Koopman and Mones as to claims 1 to 3 and 10 to 12,
with the addition of Temple as to claims 4 to 8 and 13 to 17.
Rather than repeat the positions of the appellants and the
examiner, reference is made to the brief and the answer for the
respective details thereof.
OPINION
2
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