Appeal No. 96-0523
Application 07/910,763
Claims 1, 6-8, 11, and 12
Only Stopper is required in the rejection of independent
claims 1, 8, and 12 and dependent claims 6, 7, and 11. Quinn
is cited by the examiner for the teachings of a fuse and for
forming semiconductor chips by cutting up the wafer; however,
these limitations are not present in the independent claims.
Stopper discloses that the "real estate of the wafer is
divided into special areas called cells and signal hookup
areas and power hookup areas are provided" (col. 6, lines
10-12). The wafer has "active die incorporated on it, which
die are isolated one from the other, and which each have die
contact sites 202 normally used for probing during testing and
for bonding during packaging" (col. 6, lines 21-24). "The
wafer has a plurality of VLSI die manufactured in accordance
with the present state of the art technology. These die are
illustrated as 256K ram chips are capable of being
manufactured by standard processes on a single wafer."
Col. 7, lines 32-36. The individual die which occupy the
cells in Stopper are "semiconductor chips" and therefore
Stopper has "a plurality of semiconductor chips formed in said
semiconductor wafer," as recited in claims 1 and 8, and
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