Appeal No. 96-0523
Application 07/910,763
"a plurality of semiconductor chips . . . on a single wafer,"
as recited in the preamble of claim 12. None of the
independent claims require that the wafer be cut into
individual die and so appellant's arguments that Stopper
teaches away from cutting the wafer into individual die
(Brief, pages 5-6) are not persuasive because they are not
commensurate in scope with the claims.
Figures 4 and 5 of Stopper show a power grid 11 with a
rail system. "In a rail system, each cell is crossed by both
rails three times in both the horizontal and vertical
directions. The power rails are connected to a pair of
contact pads 12 in each power hookup area 5." Col. 4,
lines 7-10. "[T]he power hookup areas may be provided in the
space at the 'corners.'" Col. 4, lines 64-65. The two rails
in Stopper constitute "a power supply bus line and a ground
bus line" as recited in claim 1 and "a power supply bus line
means and a ground bus line means" as recited in claims 8 and
12. The pair of contact pads in the power hookup area 5 at
the corners which are connected to the rails are "external
supply and ground terminal electrode pads formed on an outer
peripheral portion of said semiconductor wafer," as recited in
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