Appeal No. 96-1179
Application 08/190,622
deposited on said wafer arrive with orthogonal
trajectories.
The examiner relies upon the following references as
evidence of obviousness:
Hanfmann 3,904,503 Sep. 09,
1975
Riley 3,939,052 Feb. 17,
1976
Ohji et al. (Ohji) 4,315,960 Feb.
16, 1982
Talieh et al. (Talieh) 5,171,412 Dec. 15,
1992
Appellant's claimed invention is directed to a system for
sputtering material on a substrate comprising a drive means
for moving and removing a collimator into and out of a
position between the target, which is the source of plasma
atoms, and the wafer onto which the sputtered atoms are
deposited. The system is used to effect a first, collimated
deposition step and a second, non-collimated deposition step.
Appellant's principal and reply briefs fail to set forth
an argument that can be reasonably considered to be specific
to any of the rejected claims 1, 2, 7 and 8. Accordingly, the
3
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