Appeal No. 96-1406
Application No. 08/054,074
from the examiner’s rejection of claims 1, 4-22, 30 and 32-34,
which constitute all the claims remaining in the application.
An amendment after final rejection was filed on June 14, 1995
and was entered by the examiner.
The disclosed invention pertains to a semiconductor
sensor device in which a plurality of semiconductor sensor
chips are disposed adjacent to one another. A plurality of
coupling chips are provided for effecting mechanical and
electrical connection between adjacent sensor chips.
Representative claim 1 is reproduced as follows:
1. A semiconductor sensor device comprising
a plurality of semiconductor sensor chips disposed
adjacent one another; and
a plurality of coupling chips for mechanically and
electrically connecting said sensor chips together, a
respective coupling chip mechanically coupling a respective
pair of adjacent sensor chips together and having means for
electrically connecting said adjacent sensor chips to one
another so that said sensor chips form a single semiconductor
sensor device.
The examiner relies on the following references:
LeBlanc (European) 0,424,062 Apr. 24, 1991
Hatada et al. (Hatada), “LED array modules by New method
Micron Bump Bonding Method,” IEEE/CHMT IEMT Symposium,
September 1989, pages 230-233.
2
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