Appeal No. 96-1406
Application No. 08/054,074
plurality of semiconductor sensor chips should be connected by
coupling chips as recited in claim 1.
The examiner seems to have accepted that the glass
substrate of Hatada and LeBlanc cannot be considered a
plurality of coupling chips by now seeking to call the
integrated circuit chips on the support board as the plurality
of coupling chips. We cannot follow this reasoning at all.
There is no way that the integrated circuit chips on the
support board of Hatada or LeBlanc can be said to mechanically
connect adjacent sensor chips to each other.
The collective teachings of Hatada and LeBlanc do not
support the rejection proposed by the examiner. Although we
cannot say whether there is better prior art available than
the prior art applied by the examiner, we can say that the
evidence of obviousness produced by the examiner fails to
support the rejection of independent claim 1. Therefore, the
applied prior art also does not support the rejection of the
claims which depend from claim 1.
The decision of the examiner rejecting claims 1, 4-22,
7
Page: Previous 1 2 3 4 5 6 7 8 Next
Last modified: November 3, 2007