Appeal No. 96-2085
Application No. 08/301,536
Udo teaches that if there is no particular reliability
problem, the deposition of the first passivation layer
may be omitted (column 6, lines 11-14), leaving the
silicon nitride passivation layer as the sole
protection layer which may be then be [sic] etched so
that the fuse may be cut as previously done to the
first passivation layer. [Page 9 of Answer].
However, the examiner has apparently misread Udo at column 6,
lines 11-14. The relevant passage of Udo reads "[i]f there is no
particular reliability problem even if cracks 26 or 33 in the
bonding pad 20A or 30 are left exposed, only the fuses 4 need be
covered with the passivation film 27." Contrary to the
examiner's interpretation, there is no teaching here that first
passivation film 22 may be omitted in favor of only second
passivation film 27. Rather, the relevant passage relates that
only fuses 4, and not bonding pad 20A or 30, need be covered with
passivation film 27 if there is no reliability problem. As
depicted in Figure 1H, passivation layers 22 and 27 are both
present.
The examiner goes on to state that "[i]n either case, Udo
does teach that both the first and final passivation films are
etched (column 5, lines 26-34 and lines 44-60)" (page 9 of
Answer). However, the disclosures of Udo referenced by the
examiner teach etching the first and final passivation films in
the proximity of the opening 24, and not in the proximity of the
fuse. Indeed, Udo discloses that "[t]he fuses, whether or not
-5-
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