Appeal No. 96-1515
Application 08/161/859
DECISION ON APPEAL
This is a decision on the appeal under 35 U.S.C. § 134
from the examiner’s final rejection of claims 1-32. An
amendment after final rejection was filed on January 25, 1995
and was entered by the examiner [Paper No. 27]. This
amendment cancelled claim 29. Accordingly, this appeal is
directed to the rejection of claims 1-28 and 30-32, which
constitute all the claims remaining in this application.
The disclosed invention pertains to an electronic
device enclosed within a package made of a resin. In one
embodiment of the invention, the outermost surface of the
resin package is densified by treating that surface with a
plasma of an inactive gas. In a second embodiment of the
invention, the electronic device has a protective film formed
on the outermost surface of the package.
Representative claims 1 and 5 are reproduced as
follows:
1. An electronic device comprising a semiconductor chip
and a package made of a resin enclosing said semiconductor
chip, wherein an outermost surface of said package is
densified by treating said surface with a plasma of an
inactive gas, said outermost surface being in contact with
outside air.
2
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