Appeal No. 96-1515
Application 08/161/859
5. An electronic device comprising a semiconductor chip
and a package made of a resin enclosing said semiconductor
chip, wherein said device is characterized in that a
protective film is formed on the outermost surface of said
electronic device, said protective film being in contact with
outside air.
The examiner relies on the following references:
Omori et al. (Omori) 4,972,250 Nov. 20,
1990
(filed Mar. 02,
1987)
Iga (Japanese Kokai) 62-155542 July 10,
1987
Kihira (Japanese Kokai) 63-15448 Jan. 22,
1988
Claims 1, 5, 15 and 28 stand rejected under 35 U.S.C.
§ 112, first paragraph, as being based on an inadequate
disclosure. Claims 1-4, 7, 15-28 and 30-32 stand rejected
under 35 U.S.C. § 103 as being unpatentable over the teachings
of Iga. Claims 5, 6 and 14 stand rejected under 35 U.S.C. §
102(b) as anticipated by or, in the alternative, under 35
U.S.C. § 103 as obvious over Iga. Claims 8-13 stand rejected
under 35 U.S.C. § 103 as being unpatentable over the
teachings of Iga in view of Kihira and Omori.
Rather than repeat the arguments of appellants or the
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