Appeal No. 96-2243
Application 08/327,447
This is a decision on appeal from the final
rejection of claims 19 through 27 and 30 through 39, all of
the claims pending in the present application.
The invention relates to a package for semiconductor
chips. In particular, referring to Figures 1 and 2, a semi-
conductor chip package 2 is shown with four chips 4. A thin
printed circuit 8 (a first level interconnect), contains
conductive tracks 20, and overlies the chips 4. Each end 10
of the printed circuit 8 contains outer leads 12 which extend
outside the chip package 2. Bond wires 38 (a second level
interconnect), connect each chip to the tracks 20 on the upper
side of printed circuit 8.
Representative independent claims 19 and 30 are
reproduced as follows:
19. A semiconductor device comprising:
at least one semiconductor chip, the or each
semiconductor chip having a plurality of chip bonding pads,
a first level interconnect comprising a printed
circuit which overlies the at least one semiconductor chip and
is disposed adjacent to the chip bonding pads of the at least
one semiconductor chip, the printed circuit having contacts
which are located on a side of the printed circuit remote from
the or each semiconductor chip and which overlie the at least
one semiconductor chip, and
2
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