Appeal No. 96-3106
Application 08/052,015
and 19, claims 10 through 17 having been canceled . 2
The disclosed invention pertains to a package for
multiple high power electrical components. The package
comprises a plurality of subassemblies 18 which each include a
semiconductor device 20, and which are disposed on the package
support member 12 in an array surrounding a central electrode
structure 16. Each semiconductor device includes at least a
first electrode and a second electrode. The first electrodes
of all the semiconductor devices are electrically connected to
the package support member 12. The second electrodes of all
the semiconductor devices are connected to the central
electrode structure 16 via tab 44, and then to terminal 104.
As a result of this structure, a compact package is attained.
The package further facilitates the testing of its
subassemblies prior to incorporation therein to reduce waste.
Representative claim 1 is reproduced as follows:
2An amendment after final was filed on June 28, 1995.
It made no changes to the claims, and is considered entered in
the record here.
-2-
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